thermal: Add PCIe cooling driver

Add a thermal cooling driver to provide path to access PCIe bandwidth
controller using the usual thermal interfaces.

A cooling device is instantiated for controllab

thermal: Add PCIe cooling driver

Add a thermal cooling driver to provide path to access PCIe bandwidth
controller using the usual thermal interfaces.

A cooling device is instantiated for controllable PCIe Ports from the
bwctrl service driver.

If registering the cooling device fails, allow bwctrl's probe to succeed
regardless. As cdev in that case contains IS_ERR() pseudo "pointer", clean
that up inside the probe function so the remove side doesn't need to
suddenly make an odd looking IS_ERR() check.

The thermal side state 0 means no throttling, i.e., maximum supported PCIe
Link Speed.

Link: https://lore.kernel.org/r/[email protected]
Signed-off-by: Ilpo Järvinen <[email protected]>
[bhelgaas: dropped data->cdev test per
https://lore.kernel.org/r/[email protected]]
Signed-off-by: Bjorn Helgaas <[email protected]>
Reviewed-by: Jonathan Cameron <[email protected]>
Acked-by: Rafael J. Wysocki <[email protected]> # From the cooling device interface perspective

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thermal: core: Add user thresholds support

The user thresholds mechanism is a way to have the userspace to tell
the thermal framework to send a notification when a temperature limit
is crossed. Ther

thermal: core: Add user thresholds support

The user thresholds mechanism is a way to have the userspace to tell
the thermal framework to send a notification when a temperature limit
is crossed. There is no id, no hysteresis, just the temperature and
the direction of the limit crossing. That means we can be notified
when a threshold is crossed the way up only, or the way down only or
both ways. That allows to create hysteresis values if it is needed.

A threshold can be added, deleted or flushed. The latter means all
thresholds belonging to a thermal zone will be deleted.

When a threshold is added:

- if the same threshold (temperature and direction) exists, an error
is returned

- if a threshold is specified with the same temperature but a
different direction, the specified direction is added

- if there is no threshold with the same temperature then it is
created

When a threshold is deleted:

- if the same threshold (temperature and direction) exists, it is
deleted

- if a threshold is specified with the same temperature but a
different direction, the specified direction is removed

- if there is no threshold with the same temperature, then an error
is returned

When the threshold are flushed:

- All thresholds related to a thermal zone are deleted

When a threshold is crossed:

- the userspace does not need to know which threshold(s) have been
crossed, it will be notified with the current temperature and the
previous temperature

- if multiple thresholds have been crossed between two updates only
one notification will be send to the userspace, it is pointless to
send a notification per thresholds crossed as the userspace can
handle that easily when it has the temperature delta information

Signed-off-by: Daniel Lezcano <[email protected]>
Link: https://patch.msgid.link/[email protected]
[ rjw: Subject edit, use BIT(0) and BIT(1) in symbol definitions ]
Signed-off-by: Rafael J. Wysocki <[email protected]>

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thermal: Introduce a debugfs-based testing facility

Introduce a facility allowing the thermal core functionality to be
exercised in a controlled way in order to verify its behavior, without
affectin

thermal: Introduce a debugfs-based testing facility

Introduce a facility allowing the thermal core functionality to be
exercised in a controlled way in order to verify its behavior, without
affecting its regular users noticeably.

It is based on the idea of preparing thermal zone templates along with
their trip points by writing to files in debugfs. When ready, those
templates can be used for registering test thermal zones with the
thermal core.

The temperature of a test thermal zone created this way can be adjusted
via debugfs, which also triggers a __thermal_zone_device_update() call
for it. By manipulating the temperature of a test thermal zone, one can
check if the thermal core reacts to the changes of it as expected.

Signed-off-by: Rafael J. Wysocki <[email protected]>
Link: https://patch.msgid.link/[email protected]
[ rjw: Fixed ordering of kcalloc() arguments ]
[ rjw: Fixed debugfs_create_dir() return value checks ]
[ rjw: Fixed two kerneldoc comments ]
Signed-off-by: Rafael J. Wysocki <[email protected]>

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thermal/drivers/renesas: Group all renesas thermal drivers together

Move all Renesas thermal drivers to a vendor specific directory.

All drivers are moved verbatim apart from the updated include pa

thermal/drivers/renesas: Group all renesas thermal drivers together

Move all Renesas thermal drivers to a vendor specific directory.

All drivers are moved verbatim apart from the updated include path for
thermal_hwmon.h.

Signed-off-by: Niklas Söderlund <[email protected]>
Signed-off-by: Daniel Lezcano <[email protected]>
Link: https://lore.kernel.org/r/[email protected]

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thermal: Drop spaces before TABs

There is never a need to have a space before a TAB, but it hurts the
eyes of vim users.

Signed-off-by: Geert Uytterhoeven <[email protected]>
Signed-off-by: D

thermal: Drop spaces before TABs

There is never a need to have a space before a TAB, but it hurts the
eyes of vim users.

Signed-off-by: Geert Uytterhoeven <[email protected]>
Signed-off-by: Daniel Lezcano <[email protected]>
Link: https://lore.kernel.org/r/480478a53fd42621e97b2db36e181903cc0f53e3.1708001426.git.geert+renesas@glider.be

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thermal/debugfs: Add thermal cooling device debugfs information

The thermal framework does not have any debug information except a
sysfs stat which is a bit controversial. This one allocates big chu

thermal/debugfs: Add thermal cooling device debugfs information

The thermal framework does not have any debug information except a
sysfs stat which is a bit controversial. This one allocates big chunks
of memory for every cooling devices with a high number of states and
could represent on some systems in production several megabytes of
memory for just a portion of it. As the sysfs is limited to a page
size, the output is not exploitable with large data array and gets
truncated.

The patch provides the same information than sysfs except the
transitions are dynamically allocated, thus they won't show more
events than the ones which actually occurred. There is no longer a
size limitation and it opens the field for more debugging information
where the debugfs is designed for, not sysfs.

The thermal debugfs directory structure tries to stay consistent with
the sysfs one but in a very simplified way:

thermal/
-- cooling_devices
|-- 0
| |-- clear
| |-- time_in_state_ms
| |-- total_trans
| `-- trans_table
|-- 1
| |-- clear
| |-- time_in_state_ms
| |-- total_trans
| `-- trans_table
|-- 2
| |-- clear
| |-- time_in_state_ms
| |-- total_trans
| `-- trans_table
|-- 3
| |-- clear
| |-- time_in_state_ms
| |-- total_trans
| `-- trans_table
`-- 4
|-- clear
|-- time_in_state_ms
|-- total_trans
`-- trans_table

The content of the files in the cooling devices directory is the same
as the sysfs one except for the trans_table which has the following
format:

Transition Hits
1->0 246
0->1 246
2->1 632
1->2 632
3->2 98
2->3 98

Signed-off-by: Daniel Lezcano <[email protected]>
[ rjw: White space fixups, rebase ]
Signed-off-by: Rafael J. Wysocki <[email protected]>

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thermal: ACPI: Move the ACPI thermal library to drivers/acpi/

The ACPI thermal library contains functions that can be used to
retrieve trip point temperature values through the platform firmware
for

thermal: ACPI: Move the ACPI thermal library to drivers/acpi/

The ACPI thermal library contains functions that can be used to
retrieve trip point temperature values through the platform firmware
for various types of trip points. Each of these functions basically
evaluates a specific ACPI object, checks if the value produced by it
is reasonable and returns it (or THERMAL_TEMP_INVALID if anything
fails).

It made sense to hold it in drivers/thermal/ so long as it was only used
by the code in that directory, but since it is also going to be used by
the ACPI thermal driver located in drivers/acpi/, move it to the latter
in order to keep the code related to evaluating ACPI objects defined in
the specification proper together.

No intentional functional impact.

Signed-off-by: Rafael J. Wysocki <[email protected]>

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thermal/drivers/loongson-2: Add thermal management support

This patch adds the support for Loongson-2 thermal sensor controller,
which can support maximum four sensor selectors that corresponding to

thermal/drivers/loongson-2: Add thermal management support

This patch adds the support for Loongson-2 thermal sensor controller,
which can support maximum four sensor selectors that corresponding to four
sets of thermal control registers and one set of sampling register. The
sensor selector can selector a speific thermal sensor as temperature input.
The sampling register is used to obtain the temperature in real time, the
control register GATE field is used to set the threshold of high or low
temperature, when the input temperature is higher than the high temperature
threshold or lower than the low temperature threshold, an interrupt will
occur.

Signed-off-by: zhanghongchen <[email protected]>
Signed-off-by: Yinbo Zhu <[email protected]>
Signed-off-by: Daniel Lezcano <[email protected]>
Link: https://lore.kernel.org/r/[email protected]

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thermal/core: Relocate the traces definition in thermal directory

The traces are exported but only local to the thermal core code. On
the other side, the traces take the thermal zone device structur

thermal/core: Relocate the traces definition in thermal directory

The traces are exported but only local to the thermal core code. On
the other side, the traces take the thermal zone device structure as
argument, thus they have to rely on the exported thermal.h header
file. As we want to move the structure to the private thermal core
header, first we have to relocate those traces to the same place as
many drivers do.

Cc: Steven Rostedt <[email protected]>
Suggested-by: Steven Rostedt <[email protected]>
Signed-off-by: Daniel Lezcano <[email protected]>
Reviewed-by: Steven Rostedt (Google) <[email protected]>
Link: https://lore.kernel.org/r/[email protected]

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thermal/drivers/mediatek: Relocate driver to mediatek folder

Add MediaTek proprietary folder to upstream more thermal zone and cooler
drivers, relocate the original thermal controller driver to it,

thermal/drivers/mediatek: Relocate driver to mediatek folder

Add MediaTek proprietary folder to upstream more thermal zone and cooler
drivers, relocate the original thermal controller driver to it, and rename it
as "auxadc_thermal.c" to show its purpose more clearly.

Signed-off-by: Balsam CHIHI <[email protected]>
Reviewed-by: AngeloGioacchino Del Regno <[email protected]>
Link: https://lore.kernel.org/r/[email protected]
Signed-off-by: Daniel Lezcano <[email protected]>
Signed-off-by: Rafael J. Wysocki <[email protected]>

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thermal/core: Move the thermal trip code to a dedicated file

The thermal_core.c files contains a lot of functions handling
different thermal components like the governors, the trip points, the
cooli

thermal/core: Move the thermal trip code to a dedicated file

The thermal_core.c files contains a lot of functions handling
different thermal components like the governors, the trip points, the
cooling device, the OF cooling device, etc ...

This organization does not help to migrate to a more sane code where
there is a better self-encapsulation as all the components' internals
can be directly accessed from a single file.

For the sake of clarity, let's move the thermal trip points code in a
dedicated thermal_trip.c file and add a function to browse all the
trip points like we do with the thermal zones, the govenors and the
cooling devices.

The same can be done for the cooling devices and the governor code but
that will come later as the current work in the thermal framework is
to fix the trip point handling and use a generic trip point structure.

No functional changes intended.

Signed-off-by: Daniel Lezcano <[email protected]>
Reviewed-by: Zhang Rui <[email protected]>
Signed-off-by: Rafael J. Wysocki <[email protected]>

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thermal: ACPI: Add ACPI trip point routines

Add library routines to populate a generic thermal trip point
structure with data obtained by evaluating a specific object in the
ACPI Namespace.

Signed-

thermal: ACPI: Add ACPI trip point routines

Add library routines to populate a generic thermal trip point
structure with data obtained by evaluating a specific object in the
ACPI Namespace.

Signed-off-by: Rafael J. Wysocki <[email protected]>
Co-developed-by: Daniel Lezcano <[email protected]>
Signed-off-by: Daniel Lezcano <[email protected]>
Tested-by: Srinivas Pandruvada <[email protected]>

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thermal/drivers/qcom: Drop false build dependency of all QCOM drivers on QCOM_TSENS

The SPMI QCOM drivers have no dependency in Kconfig, but the Makefile
will not be included without QCOM_TSENS. Thi

thermal/drivers/qcom: Drop false build dependency of all QCOM drivers on QCOM_TSENS

The SPMI QCOM drivers have no dependency in Kconfig, but the Makefile
will not be included without QCOM_TSENS. This unnecessarily reduces
build coverage.

Signed-off-by: Jonathan Cameron <[email protected]>
Cc: Dmitry Baryshkov <[email protected]>
Cc: Bhupesh Sharma <[email protected]>
Acked-by: Amit Kucheria <[email protected]>
Reviewed-by: Bhupesh Sharma <[email protected]>
Link: https://lore.kernel.org/r/[email protected]
Signed-off-by: Daniel Lezcano <[email protected]>

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thermal: k3_j72xx_bandgap: Add the bandgap driver support

Add VTM thermal support. In the Voltage Thermal Management
Module(VTM), K3 J72XX supplies a voltage reference and a temperature
sensor featu

thermal: k3_j72xx_bandgap: Add the bandgap driver support

Add VTM thermal support. In the Voltage Thermal Management
Module(VTM), K3 J72XX supplies a voltage reference and a temperature
sensor feature that are gathered in the band gap voltage and
temperature sensor (VBGAPTS) module. The band gap provides current and
voltage reference for its internal circuits and other analog IP
blocks. The analog-to-digital converter (ADC) produces an output value
that is proportional to the silicon temperature.

Currently reading temperatures only is supported. There are no
active/passive cooling agent supported.

J721e SoCs have errata i2128: https://www.ti.com/lit/pdf/sprz455

The VTM Temperature Monitors (TEMPSENSORs) are trimmed during production,
with the resulting values stored in software-readable registers. Software
should use these register values when translating the Temperature
Monitor output codes to temperature values.

It has an involved workaround. Software needs to read the error codes for
-40C, 30C, 125C from the efuse for each device & derive a new look up table
for adc to temperature conversion. Involved calculating slopes & constants
using 3 different straight line equations with adc refernce codes as the
y-axis & error codes in the x-axis.

-40C to 30C
30C to 125C
125C to 150C

With the above 2 line equations we derive the full look-up table to
workaround the errata i2128 for j721e SoC.

Tested temperature reading on J721e SoC & J7200 SoC.

[[email protected]: Generate look-up tables run-time]

Signed-off-by: Daniel Lezcano <[email protected]>
Signed-off-by: Keerthy <[email protected]>
Link: https://lore.kernel.org/r/[email protected]
Signed-off-by: Daniel Lezcano <[email protected]>

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thermal/drivers: Add TSU driver for RZ/G2L

The RZ/G2L SoC incorporates a thermal sensor unit (TSU) that measures the
temperature inside the LSI.

The thermal sensor in this unit measures temperature

thermal/drivers: Add TSU driver for RZ/G2L

The RZ/G2L SoC incorporates a thermal sensor unit (TSU) that measures the
temperature inside the LSI.

The thermal sensor in this unit measures temperatures in the range from
−40 degree Celsius to 125 degree Celsius with an accuracy of ±3°C. The
TSU repeats measurement at 20 microseconds intervals and automatically
updates the results of measurement.

The TSU has no interrupts as well as no external pins.

This patch adds Thermal Sensor Unit(TSU) driver for RZ/G2L SoC.

Signed-off-by: Biju Das <[email protected]>
Reviewed-by: Lad Prabhakar <[email protected]>
Link: https://lore.kernel.org/r/[email protected]
Signed-off-by: Daniel Lezcano <[email protected]>

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thermal/drivers/zx: Remove zx driver

The zte zx platform is getting removed, so this driver is no
longer needed.

Cc: Jun Nie <[email protected]>
Cc: Shawn Guo <[email protected]>
Signed-off-by:

thermal/drivers/zx: Remove zx driver

The zte zx platform is getting removed, so this driver is no
longer needed.

Cc: Jun Nie <[email protected]>
Cc: Shawn Guo <[email protected]>
Signed-off-by: Arnd Bergmann <[email protected]>
Signed-off-by: Daniel Lezcano <[email protected]>
Link: https://lore.kernel.org/r/[email protected]

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thermal/drivers/tango: Remove tango driver

The tango platform is getting removed, so the driver is no
longer needed.

Cc: Marc Gonzalez <[email protected]>
Cc: Mans Rullgard <[email protected]>
S

thermal/drivers/tango: Remove tango driver

The tango platform is getting removed, so the driver is no
longer needed.

Cc: Marc Gonzalez <[email protected]>
Cc: Mans Rullgard <[email protected]>
Signed-off-by: Arnd Bergmann <[email protected]>
Acked-by: Mans Rullgard <[email protected]>
Signed-off-by: Daniel Lezcano <[email protected]>
Link: https://lore.kernel.org/r/[email protected]

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thermal/drivers/clock_cooling: Remove clock_cooling code

clock_cooling has no in-kernel users. It has never found any use in
drivers as far as I can tell.

Remove the code.

Signed-off-by: Amit Kuch

thermal/drivers/clock_cooling: Remove clock_cooling code

clock_cooling has no in-kernel users. It has never found any use in
drivers as far as I can tell.

Remove the code.

Signed-off-by: Amit Kucheria <[email protected]>
Signed-off-by: Daniel Lezcano <[email protected]>
Link: https://lore.kernel.org/r/aa5d5ac2589cf7b14ece882130731b4a916849a6.1593619943.git.amit.kucheria@linaro.org

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thermal: netlink: Fix compilation error when CONFIG_NET=n

When the network is not configured, the netlink is disabled on all
the system. The thermal framework assumed the netlink is always
opt-in.

thermal: netlink: Fix compilation error when CONFIG_NET=n

When the network is not configured, the netlink is disabled on all
the system. The thermal framework assumed the netlink is always
opt-in.

Fix this by adding a Kconfig option for the netlink notification,
defaulting to yes and depending on CONFIG_NET.

As the change implies multiple stubs and in order to not pollute the
internal thermal header, the thermal_nelink.h has been added and
included in the thermal_core.h, so this one regain some kind of
clarity.

Reported-by: Randy Dunlap <[email protected]>
Signed-off-by: Daniel Lezcano <[email protected]>
Reviewed-by: Amit Kucheria <[email protected]>
Link: https://lore.kernel.org/r/[email protected]

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thermal: core: genetlink support for events/cmd/sampling

Initially the thermal framework had a very simple notification
mechanism to send generic netlink messages to the userspace.

The notification

thermal: core: genetlink support for events/cmd/sampling

Initially the thermal framework had a very simple notification
mechanism to send generic netlink messages to the userspace.

The notification function was never called from anywhere and the
corresponding dead code was removed. It was probably a first attempt
to introduce the netlink notification.

At LPC2018, the presentation "Linux thermal: User kernel interface",
proposed to create the notifications to the userspace via a kfifo.

The advantage of the kfifo is the performance. It is usually used from
a 1:1 communication channel where a driver captures data and sends it
as fast as possible to a userspace process.

The drawback is that only one process uses the notification channel
exclusively, thus no other process is allowed to use the channel to
get temperature or notifications.

This patch defines a generic netlink API to discover the current
thermal setup and adds event notifications as well as temperature
sampling. As any genetlink protocol, it can evolve and the versioning
allows to keep the backward compatibility.

In order to prevent the user from getting flooded with data on a
single channel, there are two multicast channels, one for the
temperature sampling when the thermal zone is updated and another one
for the events, so the user can get the events only without the
thermal zone temperature sampling.

Also, a list of commands to discover the thermal setup is added and
can be extended when needed.

Reviewed-by: Amit Kucheria <[email protected]>
Signed-off-by: Daniel Lezcano <[email protected]>
Acked-by: Zhang Rui <[email protected]>
Link: https://lore.kernel.org/r/[email protected]

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thermal: Add support for the MCU controlled FAN on Khadas boards

The new Khadas VIM2 and VIM3 boards controls the cooling fan via the
on-board microcontroller.

This implements the FAN control as th

thermal: Add support for the MCU controlled FAN on Khadas boards

The new Khadas VIM2 and VIM3 boards controls the cooling fan via the
on-board microcontroller.

This implements the FAN control as thermal devices and as cell of the Khadas
MCU MFD driver.

Signed-off-by: Neil Armstrong <[email protected]>
Reviewed-by: Amit Kucheria <[email protected]>
Acked-by: Daniel Lezcano <[email protected]>
Signed-off-by: Lee Jones <[email protected]>

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thermal/of: Rename of-thermal.c

Core thermal framework code files should start with thermal_*.
of-thermal.c does not follow this pattern and can easily be confused
with platform driver.

Fix this by

thermal/of: Rename of-thermal.c

Core thermal framework code files should start with thermal_*.
of-thermal.c does not follow this pattern and can easily be confused
with platform driver.

Fix this by renaming it to thermal_of.c

Signed-off-by: Amit Kucheria <[email protected]>
Signed-off-by: Daniel Lezcano <[email protected]>
Link: https://lore.kernel.org/r/f5e233d5c5dcc7c7cb56b3448da255cb2c9ef0d1.1589199124.git.amit.kucheria@linaro.org

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thermal/governors: Prefix all source files with gov_

Bang-bang governor source file is prefixed with gov_. Do the same for
other governors for consistency so they're easy to find in the sources.

Si

thermal/governors: Prefix all source files with gov_

Bang-bang governor source file is prefixed with gov_. Do the same for
other governors for consistency so they're easy to find in the sources.

Signed-off-by: Amit Kucheria <[email protected]>
Signed-off-by: Daniel Lezcano <[email protected]>
Link: https://lore.kernel.org/r/b9a85d3204712f14e320504948c12712dc0b291b.1589199124.git.amit.kucheria@linaro.org

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thermal: k3: Add support for bandgap sensors

Add VTM thermal support. In the Voltage Thermal Management
Module(VTM), K3 AM654 supplies a voltage reference and a temperature
sensor feature that are g

thermal: k3: Add support for bandgap sensors

Add VTM thermal support. In the Voltage Thermal Management
Module(VTM), K3 AM654 supplies a voltage reference and a temperature
sensor feature that are gathered in the band gap voltage and
temperature sensor (VBGAPTS) module. The band gap provides current and
voltage reference for its internal circuits and other analog IP
blocks. The analog-to-digital converter (ADC) produces an output value
that is proportional to the silicon temperature.

Currently reading temperatures only is supported. There are no
active/passive cooling agent supported.

Signed-off-by: Keerthy <[email protected]>
Reviewed-by: Amit Kucheria <[email protected]>
Signed-off-by: Daniel Lezcano <[email protected]>
Link: https://lore.kernel.org/r/[email protected]

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thermal: imx8mm: Add support for i.MX8MM thermal monitoring unit

i.MX8MM has a thermal monitoring unit(TMU) inside, it ONLY has one
sensor for CPU, add support for reading immediate temperature of
t

thermal: imx8mm: Add support for i.MX8MM thermal monitoring unit

i.MX8MM has a thermal monitoring unit(TMU) inside, it ONLY has one
sensor for CPU, add support for reading immediate temperature of
this sensor.

Signed-off-by: Anson Huang <[email protected]>
Signed-off-by: Daniel Lezcano <[email protected]>
Link: https://lore.kernel.org/r/[email protected]

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