thermal: Add PCIe cooling driver

Add a thermal cooling driver to provide path to access PCIe bandwidth
controller using the usual thermal interfaces.

A cooling device is instantiated for controllab

thermal: Add PCIe cooling driver

Add a thermal cooling driver to provide path to access PCIe bandwidth
controller using the usual thermal interfaces.

A cooling device is instantiated for controllable PCIe Ports from the
bwctrl service driver.

If registering the cooling device fails, allow bwctrl's probe to succeed
regardless. As cdev in that case contains IS_ERR() pseudo "pointer", clean
that up inside the probe function so the remove side doesn't need to
suddenly make an odd looking IS_ERR() check.

The thermal side state 0 means no throttling, i.e., maximum supported PCIe
Link Speed.

Link: https://lore.kernel.org/r/[email protected]
Signed-off-by: Ilpo Järvinen <[email protected]>
[bhelgaas: dropped data->cdev test per
https://lore.kernel.org/r/[email protected]]
Signed-off-by: Bjorn Helgaas <[email protected]>
Reviewed-by: Jonathan Cameron <[email protected]>
Acked-by: Rafael J. Wysocki <[email protected]> # From the cooling device interface perspective

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thermal/drivers/sti: Depend on THERMAL_OF subsystem

Switch to thermal_of_zone to handle thermal-zones. Replace
thermal_zone_device_register() by devm_thermal_of_zone_register() and
remove ops st_the

thermal/drivers/sti: Depend on THERMAL_OF subsystem

Switch to thermal_of_zone to handle thermal-zones. Replace
thermal_zone_device_register() by devm_thermal_of_zone_register() and
remove ops st_thermal_get_trip_type, st_thermal_get_trip_temp.

Signed-off-by: Raphael Gallais-Pou <[email protected]>
Link: https://lore.kernel.org/r/[email protected]
Signed-off-by: Daniel Lezcano <[email protected]>

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thermal: Introduce a debugfs-based testing facility

Introduce a facility allowing the thermal core functionality to be
exercised in a controlled way in order to verify its behavior, without
affectin

thermal: Introduce a debugfs-based testing facility

Introduce a facility allowing the thermal core functionality to be
exercised in a controlled way in order to verify its behavior, without
affecting its regular users noticeably.

It is based on the idea of preparing thermal zone templates along with
their trip points by writing to files in debugfs. When ready, those
templates can be used for registering test thermal zones with the
thermal core.

The temperature of a test thermal zone created this way can be adjusted
via debugfs, which also triggers a __thermal_zone_device_update() call
for it. By manipulating the temperature of a test thermal zone, one can
check if the thermal core reacts to the changes of it as expected.

Signed-off-by: Rafael J. Wysocki <[email protected]>
Link: https://patch.msgid.link/[email protected]
[ rjw: Fixed ordering of kcalloc() arguments ]
[ rjw: Fixed debugfs_create_dir() return value checks ]
[ rjw: Fixed two kerneldoc comments ]
Signed-off-by: Rafael J. Wysocki <[email protected]>

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thermal/drivers/renesas: Group all renesas thermal drivers together

Move all Renesas thermal drivers to a vendor specific directory.

All drivers are moved verbatim apart from the updated include pa

thermal/drivers/renesas: Group all renesas thermal drivers together

Move all Renesas thermal drivers to a vendor specific directory.

All drivers are moved verbatim apart from the updated include path for
thermal_hwmon.h.

Signed-off-by: Niklas Söderlund <[email protected]>
Signed-off-by: Daniel Lezcano <[email protected]>
Link: https://lore.kernel.org/r/[email protected]

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thermal: Get rid of CONFIG_THERMAL_WRITABLE_TRIPS

The only difference made by CONFIG_THERMAL_WRITABLE_TRIPS is whether or
not the writable trips mask passed during thermal zone registration
will tak

thermal: Get rid of CONFIG_THERMAL_WRITABLE_TRIPS

The only difference made by CONFIG_THERMAL_WRITABLE_TRIPS is whether or
not the writable trips mask passed during thermal zone registration
will take any effect, but whoever passes a non-zero writable trips mask
to thermal_zone_device_register_with_trips() can be forgiven thinking
that it will always work.

Moreover, some thermal drivers expect user space to set trip temperature
values, so they select CONFIG_THERMAL_WRITABLE_TRIPS, possibly overriding
a manual choice to unset it and going against the design purportedly
allowing system integrators to decide on the writability of trip points
for the given kernel build. It is also set in one platform's defconfig.

Forthermore, CONFIG_THERMAL_WRITABLE_TRIPS only affects trip temperature,
because trip hysteresis is writable as long as the thermal zone provides
a callback to update it, regardless of the CONFIG_THERMAL_WRITABLE_TRIPS
value.

The above means that the symbol in question is used inconsistently and
its purpose is at least moot, so remove it and always take the writable
trip mask passed to thermal_zone_device_register_with_trips() into
account.

Signed-off-by: Rafael J. Wysocki <[email protected]>
Reviewed-by: Daniel Lezcano <[email protected]>

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thermal/debugfs: Add thermal cooling device debugfs information

The thermal framework does not have any debug information except a
sysfs stat which is a bit controversial. This one allocates big chu

thermal/debugfs: Add thermal cooling device debugfs information

The thermal framework does not have any debug information except a
sysfs stat which is a bit controversial. This one allocates big chunks
of memory for every cooling devices with a high number of states and
could represent on some systems in production several megabytes of
memory for just a portion of it. As the sysfs is limited to a page
size, the output is not exploitable with large data array and gets
truncated.

The patch provides the same information than sysfs except the
transitions are dynamically allocated, thus they won't show more
events than the ones which actually occurred. There is no longer a
size limitation and it opens the field for more debugging information
where the debugfs is designed for, not sysfs.

The thermal debugfs directory structure tries to stay consistent with
the sysfs one but in a very simplified way:

thermal/
-- cooling_devices
|-- 0
| |-- clear
| |-- time_in_state_ms
| |-- total_trans
| `-- trans_table
|-- 1
| |-- clear
| |-- time_in_state_ms
| |-- total_trans
| `-- trans_table
|-- 2
| |-- clear
| |-- time_in_state_ms
| |-- total_trans
| `-- trans_table
|-- 3
| |-- clear
| |-- time_in_state_ms
| |-- total_trans
| `-- trans_table
`-- 4
|-- clear
|-- time_in_state_ms
|-- total_trans
`-- trans_table

The content of the files in the cooling devices directory is the same
as the sysfs one except for the trans_table which has the following
format:

Transition Hits
1->0 246
0->1 246
2->1 632
1->2 632
3->2 98
2->3 98

Signed-off-by: Daniel Lezcano <[email protected]>
[ rjw: White space fixups, rebase ]
Signed-off-by: Rafael J. Wysocki <[email protected]>

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thermal: ACPI: Move the ACPI thermal library to drivers/acpi/

The ACPI thermal library contains functions that can be used to
retrieve trip point temperature values through the platform firmware
for

thermal: ACPI: Move the ACPI thermal library to drivers/acpi/

The ACPI thermal library contains functions that can be used to
retrieve trip point temperature values through the platform firmware
for various types of trip points. Each of these functions basically
evaluates a specific ACPI object, checks if the value produced by it
is reasonable and returns it (or THERMAL_TEMP_INVALID if anything
fails).

It made sense to hold it in drivers/thermal/ so long as it was only used
by the code in that directory, but since it is also going to be used by
the ACPI thermal driver located in drivers/acpi/, move it to the latter
in order to keep the code related to evaluating ACPI objects defined in
the specification proper together.

No intentional functional impact.

Signed-off-by: Rafael J. Wysocki <[email protected]>

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thermal/drivers/loongson-2: Add thermal management support

This patch adds the support for Loongson-2 thermal sensor controller,
which can support maximum four sensor selectors that corresponding to

thermal/drivers/loongson-2: Add thermal management support

This patch adds the support for Loongson-2 thermal sensor controller,
which can support maximum four sensor selectors that corresponding to four
sets of thermal control registers and one set of sampling register. The
sensor selector can selector a speific thermal sensor as temperature input.
The sampling register is used to obtain the temperature in real time, the
control register GATE field is used to set the threshold of high or low
temperature, when the input temperature is higher than the high temperature
threshold or lower than the low temperature threshold, an interrupt will
occur.

Signed-off-by: zhanghongchen <[email protected]>
Signed-off-by: Yinbo Zhu <[email protected]>
Signed-off-by: Daniel Lezcano <[email protected]>
Link: https://lore.kernel.org/r/[email protected]

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thermal: Allow selecting the bang-bang governor as default

For many setups the bang-bang governor is exactly what we want. Many
ARM SoC-based devices use fans to cool down the entire SoC and that
wo

thermal: Allow selecting the bang-bang governor as default

For many setups the bang-bang governor is exactly what we want. Many
ARM SoC-based devices use fans to cool down the entire SoC and that
works well only with the bang-bang governor because it uses the
hysteresis in order to let the fan run for a while to cool the SoC
down below the trip point before switching it off again.

The step-wise governor will behave strangely in these situations. It
doesn't use the hysteresis, so it can lead to situations where the fan
is turned on for only a very brief period and then is switched back off,
only to get switched back on again very quickly because the SoC hasn't
cooled down very much.

Signed-off-by: Thierry Reding <[email protected]>
Link: https://lore.kernel.org/r/[email protected]
Signed-off-by: Daniel Lezcano <[email protected]>

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thermal/drivers/mediatek: Relocate driver to mediatek folder

Add MediaTek proprietary folder to upstream more thermal zone and cooler
drivers, relocate the original thermal controller driver to it,

thermal/drivers/mediatek: Relocate driver to mediatek folder

Add MediaTek proprietary folder to upstream more thermal zone and cooler
drivers, relocate the original thermal controller driver to it, and rename it
as "auxadc_thermal.c" to show its purpose more clearly.

Signed-off-by: Balsam CHIHI <[email protected]>
Reviewed-by: AngeloGioacchino Del Regno <[email protected]>
Link: https://lore.kernel.org/r/[email protected]
Signed-off-by: Daniel Lezcano <[email protected]>
Signed-off-by: Rafael J. Wysocki <[email protected]>

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thermal: ACPI: Add ACPI trip point routines

Add library routines to populate a generic thermal trip point
structure with data obtained by evaluating a specific object in the
ACPI Namespace.

Signed-

thermal: ACPI: Add ACPI trip point routines

Add library routines to populate a generic thermal trip point
structure with data obtained by evaluating a specific object in the
ACPI Namespace.

Signed-off-by: Rafael J. Wysocki <[email protected]>
Co-developed-by: Daniel Lezcano <[email protected]>
Signed-off-by: Daniel Lezcano <[email protected]>
Tested-by: Srinivas Pandruvada <[email protected]>

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thermal: Drop obsolete dependency on COMPILE_TEST

Since commit 0166dc11be91 ("of: make CONFIG_OF user selectable"), it
is possible to test-build any driver which depends on OF on any
architecture by

thermal: Drop obsolete dependency on COMPILE_TEST

Since commit 0166dc11be91 ("of: make CONFIG_OF user selectable"), it
is possible to test-build any driver which depends on OF on any
architecture by explicitly selecting OF. Therefore depending on
COMPILE_TEST as an alternative is no longer needed.

It is actually better to always build such drivers with OF enabled,
so that the test builds are closer to how each driver will actually be
built on its intended target. Building them without OF may not test
much as the compiler will optimize out potentially large parts of the
code. In the worst case, this could even pop false positive warnings.
Dropping COMPILE_TEST here improves the quality of our testing and
avoids wasting time on non-existent issues.

Signed-off-by: Jean Delvare <[email protected]>
Signed-off-by: Rafael J. Wysocki <[email protected]>

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thermal/governor: Remove deprecated information

The userspace governor is still in use on production systems and the
deprecating warning is scary.

Even if we want to get rid of the userspace govern

thermal/governor: Remove deprecated information

The userspace governor is still in use on production systems and the
deprecating warning is scary.

Even if we want to get rid of the userspace governor, it is too soon
yet as the alternatives are not yet adopted.

Change the deprecated warning by an information message suggesting to
switch to the netlink thermal events.

Fixes: 0275c9fb0eff ("thermal/core: Make the userspace governor deprecated")
Signed-off-by: Daniel Lezcano <[email protected]>
Signed-off-by: Rafael J. Wysocki <[email protected]>

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thermal/drivers: Add TSU driver for RZ/G2L

The RZ/G2L SoC incorporates a thermal sensor unit (TSU) that measures the
temperature inside the LSI.

The thermal sensor in this unit measures temperature

thermal/drivers: Add TSU driver for RZ/G2L

The RZ/G2L SoC incorporates a thermal sensor unit (TSU) that measures the
temperature inside the LSI.

The thermal sensor in this unit measures temperatures in the range from
−40 degree Celsius to 125 degree Celsius with an accuracy of ±3°C. The
TSU repeats measurement at 20 microseconds intervals and automatically
updates the results of measurement.

The TSU has no interrupts as well as no external pins.

This patch adds Thermal Sensor Unit(TSU) driver for RZ/G2L SoC.

Signed-off-by: Biju Das <[email protected]>
Reviewed-by: Lad Prabhakar <[email protected]>
Link: https://lore.kernel.org/r/[email protected]
Signed-off-by: Daniel Lezcano <[email protected]>

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thermal/drivers/zx: Remove zx driver

The zte zx platform is getting removed, so this driver is no
longer needed.

Cc: Jun Nie <[email protected]>
Cc: Shawn Guo <[email protected]>
Signed-off-by:

thermal/drivers/zx: Remove zx driver

The zte zx platform is getting removed, so this driver is no
longer needed.

Cc: Jun Nie <[email protected]>
Cc: Shawn Guo <[email protected]>
Signed-off-by: Arnd Bergmann <[email protected]>
Signed-off-by: Daniel Lezcano <[email protected]>
Link: https://lore.kernel.org/r/[email protected]

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thermal/drivers/tango: Remove tango driver

The tango platform is getting removed, so the driver is no
longer needed.

Cc: Marc Gonzalez <[email protected]>
Cc: Mans Rullgard <[email protected]>
S

thermal/drivers/tango: Remove tango driver

The tango platform is getting removed, so the driver is no
longer needed.

Cc: Marc Gonzalez <[email protected]>
Cc: Mans Rullgard <[email protected]>
Signed-off-by: Arnd Bergmann <[email protected]>
Acked-by: Mans Rullgard <[email protected]>
Signed-off-by: Daniel Lezcano <[email protected]>
Link: https://lore.kernel.org/r/[email protected]

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thermal: Kconfig: Update description for RCAR_GEN3_THERMAL config

The rcar_gen3_thermal driver also supports RZ/G2 SoC's, update the
description to reflect this.

Signed-off-by: Lad Prabhakar <prabh

thermal: Kconfig: Update description for RCAR_GEN3_THERMAL config

The rcar_gen3_thermal driver also supports RZ/G2 SoC's, update the
description to reflect this.

Signed-off-by: Lad Prabhakar <[email protected]>
Reviewed-by: Chris Paterson <[email protected]>
Reviewed-by: Niklas Söderlund <[email protected]>
Signed-off-by: Daniel Lezcano <[email protected]>
Link: https://lore.kernel.org/r/[email protected]

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thermal: don't make THERMAL_NETLINK 'default y'

We just don't do that. "default y" is for things that are needed for
compatibility (when an old feature is made unconditional), or for things
that ar

thermal: don't make THERMAL_NETLINK 'default y'

We just don't do that. "default y" is for things that are needed for
compatibility (when an old feature is made unconditional), or for things
that are basically part of the infrastructure of a platform.

And it can possibly be used for questions that don't enable code on
their own, but are used to enable or disable a whole slew of other
questions.

A new feature that people aren't using is never 'default y', unless it
cures cancer or ends world hunger.

Signed-off-by: Linus Torvalds <[email protected]>

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thermal/drivers/clock_cooling: Remove clock_cooling code

clock_cooling has no in-kernel users. It has never found any use in
drivers as far as I can tell.

Remove the code.

Signed-off-by: Amit Kuch

thermal/drivers/clock_cooling: Remove clock_cooling code

clock_cooling has no in-kernel users. It has never found any use in
drivers as far as I can tell.

Remove the code.

Signed-off-by: Amit Kucheria <[email protected]>
Signed-off-by: Daniel Lezcano <[email protected]>
Link: https://lore.kernel.org/r/aa5d5ac2589cf7b14ece882130731b4a916849a6.1593619943.git.amit.kucheria@linaro.org

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thermal: netlink: Fix compilation error when CONFIG_NET=n

When the network is not configured, the netlink is disabled on all
the system. The thermal framework assumed the netlink is always
opt-in.

thermal: netlink: Fix compilation error when CONFIG_NET=n

When the network is not configured, the netlink is disabled on all
the system. The thermal framework assumed the netlink is always
opt-in.

Fix this by adding a Kconfig option for the netlink notification,
defaulting to yes and depending on CONFIG_NET.

As the change implies multiple stubs and in order to not pollute the
internal thermal header, the thermal_nelink.h has been added and
included in the thermal_core.h, so this one regain some kind of
clarity.

Reported-by: Randy Dunlap <[email protected]>
Signed-off-by: Daniel Lezcano <[email protected]>
Reviewed-by: Amit Kucheria <[email protected]>
Link: https://lore.kernel.org/r/[email protected]

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thermal: Add support for the MCU controlled FAN on Khadas boards

The new Khadas VIM2 and VIM3 boards controls the cooling fan via the
on-board microcontroller.

This implements the FAN control as th

thermal: Add support for the MCU controlled FAN on Khadas boards

The new Khadas VIM2 and VIM3 boards controls the cooling fan via the
on-board microcontroller.

This implements the FAN control as thermal devices and as cell of the Khadas
MCU MFD driver.

Signed-off-by: Neil Armstrong <[email protected]>
Reviewed-by: Amit Kucheria <[email protected]>
Acked-by: Daniel Lezcano <[email protected]>
Signed-off-by: Lee Jones <[email protected]>

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thermal: qoriq: Add platform dependencies

The QorIQ Thermal Monitoring Unit is only present on Freescale E500MC
and Layerscape SoCs, and on NXP i.MX8 SoCs. Add platform dependencies
to the QORIQ_TH

thermal: qoriq: Add platform dependencies

The QorIQ Thermal Monitoring Unit is only present on Freescale E500MC
and Layerscape SoCs, and on NXP i.MX8 SoCs. Add platform dependencies
to the QORIQ_THERMAL config symbol, to avoid asking the user about it
when configuring a kernel without support for any of the aforementioned
SoCs.

Signed-off-by: Geert Uytterhoeven <[email protected]>
Acked-by: Arnd Bergmann <[email protected]>
Acked-by: Li Yang <[email protected]>
Signed-off-by: Daniel Lezcano <[email protected]>
Link: https://lore.kernel.org/r/[email protected]

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thermal: k3: Add support for bandgap sensors

Add VTM thermal support. In the Voltage Thermal Management
Module(VTM), K3 AM654 supplies a voltage reference and a temperature
sensor feature that are g

thermal: k3: Add support for bandgap sensors

Add VTM thermal support. In the Voltage Thermal Management
Module(VTM), K3 AM654 supplies a voltage reference and a temperature
sensor feature that are gathered in the band gap voltage and
temperature sensor (VBGAPTS) module. The band gap provides current and
voltage reference for its internal circuits and other analog IP
blocks. The analog-to-digital converter (ADC) produces an output value
that is proportional to the silicon temperature.

Currently reading temperatures only is supported. There are no
active/passive cooling agent supported.

Signed-off-by: Keerthy <[email protected]>
Reviewed-by: Amit Kucheria <[email protected]>
Signed-off-by: Daniel Lezcano <[email protected]>
Link: https://lore.kernel.org/r/[email protected]

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thermal: Add COMPILE_TEST support for i.MX8MM

Add COMPILE_TEST support to i.MX8MM thermal driver for better compile
testing coverage.

Signed-off-by: Anson Huang <[email protected]>
Reviewed-by: A

thermal: Add COMPILE_TEST support for i.MX8MM

Add COMPILE_TEST support to i.MX8MM thermal driver for better compile
testing coverage.

Signed-off-by: Anson Huang <[email protected]>
Reviewed-by: Amit Kucheria <[email protected]>
Signed-off-by: Daniel Lezcano <[email protected]>
Link: https://lore.kernel.org/r/[email protected]

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thermal: qoriq: Fix a compiling issue

Qoriq thermal driver is used by both PowerPC and ARM architecture.
When built for PowerPC architecture, it reports error:
undefined reference to `.__devm_regmap

thermal: qoriq: Fix a compiling issue

Qoriq thermal driver is used by both PowerPC and ARM architecture.
When built for PowerPC architecture, it reports error:
undefined reference to `.__devm_regmap_init_mmio_clk'
To fix it, select config REGMAP_MMIO.

Fixes: 4316237bd627 (thermal: qoriq: Convert driver to use regmap API)
Signed-off-by: Yuantian Tang <[email protected]>
Signed-off-by: Daniel Lezcano <[email protected]>
Link: https://lore.kernel.org/r/[email protected]

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